TechnologyPhoto: Firstpost TechSamsung to Use TSMC’s 3nm Process for Nvidia’s Next-Gen HBM Chips
Samsung will use TSMC’s 3nm process technology to produce base dies for Nvidia’s next-generation custom high-bandwidth memory (HBM) chips, marking their first collaboration at the HBM manufacturing stage. Nvidia has requested Samsung, SK Hynix, and Micron to adopt TSMC’s process for NVHBM base dies alongside sixth-generation DRAM for memory dies. Samsung plans to keep in-house production for standard HBM but may expand foundry use if demand grows.
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